Products

High density PCB

High density PCB

HDI boards are becoming ever more popular and require special processes and equipment to match the high spec technology of these boards.

HDI boards contain blind and/or buried vias and often contain micro vias of .006 or less in diameter. There are 6 main types of HDI boards, through vias, blind & buried vias, two or more HDI layer with through vias, passive substrate, coreless construction and alternate constructions.

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Technlogies
  • Ionic Test Reports
  • Blind & Buried Vias inc. Filled and Plated Over
  • High Aspect Ratio Plating
  • High Density Interconnect (HDI)
  • Sequential Build Technology
  • High Copper Weight for Inner & Outer Layer
  • Impedance & Inductance Testing
  • Back Drilling
Materials
  • FR4
  • Anti – CAF
  • High Tg
Finishes
  • ENIG
  • OSP
  • Silver
  • Tin
  • Palladium
  • Carbon Ink